Japan-Based Rapidus On Track to Revolutionize Semiconductor Industry with 2nm Process Technology by 2027

Government Aid of $3.9 Billion Approved for Rapidus in Support of 2nm, Multi-Chiplet Technologies

In recent years, Japan-based Rapidus has been working towards developing 2nm process technology with the goal of commercializing it by 2027. To support its ambitious projects, the company has received a significant grant totaling ¥590 billion yen ($3.89 billion) from the Japanese government. This funding will be used for various purposes, including developing the 2nm production node, purchasing cleanroom equipment, and funding the development of multi-chiplet packaging technology.

With this added support from the government, Rapidus is optimistic about achieving its goals and establishing itself as a key player in the semiconductor industry. The total government support now amounts to ¥920 billion ($6.068 billion), providing a strong foundation for the company’s success. While the entire project is estimated to cost around ¥5 trillion ($32.983 billion), Rapidus is confident that it will secure the necessary financing with the support from major corporations like Toyota Motor and Nippon Telegraph and Telephone.

Rapidus aims to commence testing its production by April 2025, followed by large-scale production in 2027. Commercial production of 2nm chips is expected to begin in 2025. In addition to collaborating with IBM to develop the 2nm fabrication process and constructing its manufacturing facility, Rapidus is focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, marking the first time Japan has provided subsidies for such technologies.

A notable aspect of this project is that Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes. This plant is conveniently located near the company’s fab in Bibi World, an industrial park in Chitose City where pilot-stage research and development activities will take place. Through collaborations and financial support from major corporations like Toyota Motor and Nippon Telegraph and Telephone, Rapidus believes that it can revolutionize the semiconductor industry with its cutting-edge technology.

In conclusion, Rapidus’ ambitious goal of commercializing 2nm process technology by 2027 is being supported by significant funding from both private companies and government grants worth billions of yen ($6 billion). With this financial backing, Rapidus plans to advance their research on multi-chiplet packaging technology while also utilizing state-of-the-art cleanroom equipment and collaboration with IBM to develop their own fabrication process.

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